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Data Book
AU9340
USB Memory Stick Card Reader Controller Chip Technical Reference Manual
Product Specification Official Release Revision 1.00 Public Mar 2003
Data sheet status
Objective specification Preliminary specification Product specification This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Revision History
Date Mar 2003 Revision/Model 1.00/ Initial release Description
Page 2 of 23 AU9340 USB Memory Stick Card Reader Controller Chip V1.00
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Copyright Notice Copyright 1997 - 2002 Alcor Micro Corp. All Rights Reserved. Trademark Acknowledgements The company and product names mentioned in this document may be the trademarks or registered trademarks of their manufacturers. Disclaimer Alcor Micro Corp. reserves the right to change this product without prior notice. Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without prior notice
Contact Information: Web site: http://www.alcormicro.com/ Product URL: http://www.alcormicro.com/product_AU9340.htm Taiwan Alcor Micro Corp. 4F, No 200 Kang Chien Rd., Nei Hu, Taipei, Taiwan, R.O.C. Phone: 886-2-8751-1984 Fax: 886-2-2659-7723 Santa Clara Office 2901 Tasman Drive, Suite 206 Santa Clara, CA 95054 USA Phone: (408) 845-9300 Fax: (408) 845-9086 Los Angeles Office 9400 Seventh St., Bldg. A2 Rancho Cucamonga, CA 91730 USA Phone: (909) 483-9900 Fax: (909) 944-0464
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Table of Contents
1 Introduction....................................................................... 1.1 Description......................................................................................... 1.2 Features.............................................................................................. 2 Application Block Diagram................................................. 3 Pin Assignment.................................................................. 6 6 6 7 8
4 System Architecture and Reference Design....................... 10 4.1 AU9340 Block Diagram................................................................... 10 4.2 Sample Schematics.......................................................................... 11 5 Electrical Characteristics................................................... 12 5.1 Absolute Maximum Ratings............................................................. 12 5.2 Recommended Operating Conditions........................................... 12 5.3 General DC Characteristics............................................................ 12 5.4 DC Electrical Characteristics for 5 volts operation.................... 13 5.5 Crystal Oscillator Circuit Setup for Characterization................ 13 5.6 USB Transceiver Characteristics.................................................... 14 5.7 ESD Test Results................................................................................ 18 5.8 Latch-Up Test Results....................................................................... 19 6 Mechanical Information...................................................... 21
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List of Figures
2.1 Block Diagram............................................................................................... 3.1 Pin Assignment Diagram............................................................................. 7 8
4.1 AU9340 Block Diagram................................................................................. 10 5.1 Crystal Oscillator Circuit Setup for Characterization............................ 13 5.2 Electrical Characteristics Diagram............................................................. 17 5.3 Latch-Up Test Results................................................................................... 19 6.1 Mechanical Information Diagram............................................................... 21
List of Tables
3.1 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 Pin Descriptions........................................................................................ 9 Absolute Maximum Ratings.................................................................... 12 Recommended Operating Conditions.................................................... 12 General DC Characteristics.................................................................... 12 DC Electrical Characteristics for 5 volts operation............................ 13 USB Transceiver Characteristics............................................................ 14 Absolute Maximum Ratings.................................................................... 14 DC Electrical Characteristics................................................................... 15 AC Electrical Characteristics................................................................... 16 ESD Data..................................................................................................... 18
5.10 Latch-Up Data............................................................................................ 20
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1.0 Introduction
1.1 Description
The AU9340 is a single chip integrated USB Memory Stick (MS) card reader controller. The AU9340 enabled Memory Stick card reader to be used as a removable storage disk in enormous data exchange applications between PC and PC or PC and various consumer electronic appliances. The AU9340 reads digital data saved on memory stick while users manipulating electronic devices such as digital cameras, MP3 players, PDAs and mobile phones... etc. By the AU9340, users can transfer information such as data, graphics, texts or digital images from one electronic device to another quickly and easily. With AU9340, users' knowledge will be further enhanced by the Plug-and-Play nature built into latest operation systems such as Windows 2000/XP and Mac OS X. By integrating of various analog components, the AU9340 is the most powerful and most effective solution for Memory Stick card .
1.2 Features
Fully compliant with USB v1.1 specification and USB Device Class Definition for Mass Storage, Bulk-Transport v1.0 Fully compliant with Memory Stick (MS) v1.3 Specification. Work with default driver from Windows ME, Windows 2000, Windows XP, Mac OS 9.1, and Mac OS X. Windows 98 is supported by mass storage class driver from Alcor. Ping-pong FIFO implementation for concurrent bus operation. Dedicated hardware engine for MS bus operation, average throughput over 1MB/sec for read, 680KB/sec for write operation. Support multiple sectors transfer up to 128MB to optimize performance Support optional external EEPROM for USB VID, PID and string customization Capable of handling 8 sets of built-in PID, VID and strings to minimize inventory control and improve lead production lead time LED for bus activity indication. Integrated power switch and power management circuit to meet USB 500uA power consumption during suspend with MS card in the slot. Runs at 12MHz, built-in 48 MHz PLL Built-in 3.3V regulator 28-pin SSOP package
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2.0 Application Block Diagram
Following is the application diagram of a typical memory stick card reader. By connecting the reader to a PC through USB bus, the AU9340 is acting as a bridge between the flash memory card from digital camera, MP3 player, PDA or mobile phone and PC. Figure 2.1 Block Diagram
Digital Camera
PC with USB Host Controller
MP3 Player
Memory Stick USB Memory Stick Reader
PDA
Moble Phones
PC
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3.0 Pin Assignment
The AU9340 is packed in 28-SSOP form factor. The following figure shows signal name for each pin and the table in the following page describes each pin in detail
Figure 3.1 Pin Assignment Diagram
GPI0 XTAL2 XTAL1 VCCA GNDA VCC2Card VCC5V VCC3V USB_DM USB_DP GND GPI2 VCCMS GNDMS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 Alcor Micro AU9340 28 pin SSOP
28 27 26 25 24 23 22 21 20 19 18 17 16 15
GPI1 RSTN GNDK VCCK CT3 CT1 GPO7 GPO6 EEPDATA EEPCLK MSBS MSData MSINS MSCLK
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Table 3.1 Pin Descriptions
PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Name GPI0 XTAL2 XTAL1 VCCA GNDA VCC2Card VCC5V VCC3V USB_DM USB_DP GND GPI2 VCCMS GNDMS MSCLK MSINS MSData MSBS EEPCLK EEPDATA GPO6 GPO7 CT1 CT3 VCCK GNDK RSTN GPI1 Input/Output Input Output Input Power GND Output Power Power Input/Output Input/Output GND Input Input Input Output Input Input/Output Output Input Input Output Output Input Input Power GND Input Input Description Internal ROM selection, Connect to GND or VCC Crystal Oscillator Output (12 MHz) Crystal Oscillator Input (12 MHz) Analog 3.3 Input Ground Power to MS Card 5V power supply Regulator 3.3V output for VCCA and VCCK. USB DUSB D+ Ground Internal ROM selection, Connect to GND or VCC InPut VCC3V InPut Ground to MS Power to MS Power Ground Pin #6
Connect to MS Card SCLK. #8 Connect to MS Card INS Connect to MS Card Connect to MS Card EEPROM clock EEPROM data NC Connect to LED Connect to GND Connect to Ground 3.3 Core Voltage Input Ground Connect to VCC3 Internal ROM selection, Connect to GND or VCC Data Pin #4 BS Pin #2
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4.0 System Architecture and Reference Design
4.1 AU9340 Block Diagram
Figure 4.1 AU9340 Block Diagram
Alcor Micro - AU9340 Flash Memory Card Reader Controller Chip Block Diagram
USB Upstream Port
XCVR
USB SIE
RAM
MS control FIFO
Memory Stick
Processor
ROM
Arbitrator
EEPROM Control
3.3 V Card Power
3.3 V Voltage Regulator /Power Switch
Reset POR
12MHz XTAL
EEPROM
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4.2 Sample Schematics
VCC2Card VCC FB C4 J1 VCC DATADATA+ GND FGND1 1 2 3 4 5 0.1UF F1 C5 1UF 1.5K R6 R7 39 39 GPI2 VCCMS GNDMS R5 VCC3.3 FB C6 1UF F2 C7 0.1UF VCC5V GPI0 XTAL2 XTAL1 VCCA GNDA 1 2 3 4 5 6 7 8 9 10 11 12 13 14
U1 VCC3.3 GPI0 XTAL2 XTAL1 VCCA GNDA VCC2Card VCC5V VCC3V USB_DM USB_DP GND GPI2 VCCMS GNDMS GPI1 RSTN GNDK VCCK CT3 CT1 GPO7 GPO6 EEPDATA EEPCLK MSBS MSData MSINS MSCLK 28 27 26 25 24 23 22 21 20 19 18 17 16 15 GPI1 GNDK VCCK VCC3.3 R4 VCC2Card 47K
GPO7 EEPDATA EEPCLK
JP1 VSS BS VCC SDIO RESERVED INS RESERVED SCLK VCC VSS
FB
F9
AU9340 28PIN C8 C14 0.1UF 47pF VCC3.3 FB C9 0.1UF FB F4 F3 C10 0.1UF GNDK VCCK VCC3.3 FB C16 0.1UF FB F8 F7 C15 0.1UF GNDMS GPI0 GPI1 GPI2 R17 XTAL2 0 0 0 R20 R13 VCCMS 47K 10K R16 R8
MS SOCKET
VCC3.3 VCC3.3 FB C11 0.1UF FB F6 F5 C12 0.1UF GNDA C2 18PF 1M VCCA C1 18PF R1 Y1 12MHZ XTAL1 VCC3.3 VCC3.3
R18 R19 R9
0 0 0
See internal ROM selection Optional
VCC VCC3.3 VCC5V VCC3.3
Optional Internal ROM selection
R11 R3 330 D1 GPO7 ROM Select VCC3.3
C3 1UF
GPI0 L H L H L H L H
GPI1 L L H H L L H H
GPI2 L
C13 EEPCLK EEPDATA
47K 8 7 6 5
U2 VCC WP SCL SDA A0 A1 A2 GND 1 2 3 4
A B C D
L
0.1UF
L L H H H H
Size A4 Date: Document Number
24C02 or compitable
Disclaimer: This schematic is for reference only. Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without notice.
E F G H
Rev
AU9340 demostration schematics Tuesday, December 03, 2002 Sheet 1 of 1
1.3
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5.0
Electrical Characteristics
5.1 Absolute Maximum Ratings
Table 5.1 Absolute Maximum Ratings
SYMBOL VCC VIN VOUT TSTG PARAMETER Power Supply Input Voltage Output Voltage Storage Temperature RATING -0.3 to 6.0 -0.3 to VCC+0.3 -0.3 to VCC+0.3 -40 to 125 UNITS V V V
C
5.2 Recommended Operating Conditions
Table 5.2 Recommended Operating Conditions
SYMBOL VCC VIN TOPR PARAMETER Power Supply Input Voltage Operating Temperature MIN 4.5 0 -5 TYP 5.0 MAX 5.5 VCC 85 UNITS V V
O
C
5.3 General DC Characteristics
Table 5.3 General DC Characteristics
SYMBOL IIL IIH IOZ CIN COUT CBID PARAMETER Input low current Input high current Tri-state leakage current Input capacitance Output capacitance Bi-directional buffer capacitance CONDITIONS no pull-up or pull-down no pull-up or pull-down MIN -1 -1 -10 4 4 4 TYP MAX 1 1 10 UNITS A A A F F F
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5.4 DC Electrical Characteristics for 5 volts operation
Table 5.4 DC Electrical Characteristics for 5 volts operation
( Under SYMBOL VIL VIL VIL VIL VIH VIH VIH VIH VOL VOH RI Recommended Operating Conditions and VCC=4.5v ~ 5.5v , Tj= -40OC MIN TYP to + 85OC ) UNITS V V V V V V 1.87 3.22 0.4 3.5 50 V V V V K PARAMETER Input Low Voltage Input Low Voltage Schmitt input Low Voltage Schmitt input Low V oltage Input High Voltage Input Hight Voltage Schmitt input High Voltage Schmitt input High Voltage Output low voltage Output high voltage Input Pull-up/down resistance CONDITIONS TTL CMOS TTL CMOS TTL CMOS TTL CMOS IOL=2, 4, 8, 12, 16, 24 mA IOH=2, 4, 8, 12, 16, 24 mA Vil=0V or Vih=VCC 2.2 0.7*VCC 1.10 1.84 MAX 0.8 0.3*VCC
5.5 Crystal Oscillator Circuit Setup for Characterization
The following setup was used to measure the open loop voltage gain for crystal oscillator circuits. The feedback resistor serves to bias the circuit at its quiescent operating point and the AC coupling capacitor, Cs, is much larger than C1 and C2.
Figure 5.1 Crystal Oscillator Circuit Setup for Characterization
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5.6 USB Transceiver Characteristics
SYMBOL VCC VI VI/O VO TAMB PARAMETER DC supply voltage DC input voltage range DC input range for I/Os DC output voltage range Operating ambient temperature range in free air CONDITIONS
RECOMMENDED OPERATING CONDITIONS Table 5.5 USB Transceiver Characteristics
LIMITS MIN 3.0 0 0 0 See DC and AC characteristics for individual device 0 MAX 3.6 5.5 VCC VCC 70 V V V V
UNIT
C
ABSOLUTE MAXIMUM RATINGS (Notes 1 and 2)
In accordance with the Absolute Maximum Rating System, Voltages are referenced to GND (Ground=0v)
Table 5.6 Absolute Maximum Ratings
SYMBOL PARAMETER CONDITIONS LIMITS MIN VCC IIK VI VI/O IOK VO IO IO ICC, IGND TSTO PTOT DC supply voltage DC input diode current DC input voltage DC input voltage range for I/Os DC output diode current DC output voltage DC output source sink current for VP/VM and RCV pins DC output source or sink current for D+/D- pins DC Vcc or GND current Storage temperature range Power dissipation per package -60 Vo> Vcc or Vo<0 Note 3 Vo=0 to Vcc Vo= 0 to Vcc -0.5 Vi<0 Note 3 -0.5 -0.5 -0.5 MAX +6.5 -50 +5.5 Vcc +0.5 +/-50 Vcc +0.5 +/-15 +/-50 +/-100 +150 V mA V V mA V mA mA mA
UNIT
C
mW
NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2. The performance capability of a high performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150C. 3. The input and output voltage ratings may be exceeded if the input and output clamp current ratings are observed.
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DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltages are referenced to GND (Ground=0V). LIMITS -40C to +85C MIN TYP MAX 0.3 0.4 1.5 0.8 28 28 2.2 2.4 2.8 1.1 34 35 2.7 0.3 330 0.7 0.4 0.2 600 70 9 2 +/-0.1 +/-0.5 +/-10 14 43 43 0.5 2.0
Table 5.7 DC Electrical Characteristics
SYMBOL PARAMETER TEST CONDITIONS UNIT
VHYS VIH VIL RoH RoL VOH VOL IQ Isup IFS ILS ILeak IOFF
Hysteresis on inputs HIGH level input LOW level input Output impedance (HIGH state) Output impedance (LOW state) HIGH level output (Note 3) LOW level output (Note 3) Quiescent supply current Supply current in suspend Active supply current (Full Speed) Active supply current (Low Speed) Input leakage current 3-state output OFF-state current
Vcc=3.0V to 3.6V (Note 3) Vcc=3.0V to 3.6V (Note 3) Vcc=3.0V to 3.6V (Note 3) Note 2 Note 2 Vcc=3.0V Io=6mA Vcc=3.0V Io=4mA Vcc=3.0V Io=100A Vcc=3.0V Io=6mA Vcc=3.0V Io=4mA Vcc=3.0V Io=100A Vcc=3.6V VI=Vcc or GND Io=0 Vcc=3.6V VI=Vcc or GND Io=0 Vcc=3.3V Vcc=3.3V Vcc=3.6V VI=5.5V or GND, not for I/O Pins Vi=Vih or ViL; Vo=Vcc or GND
V V V ohm ohm V V A A mA mA A A
NOTES: 1. All typical values are at Vcc=3.3V and Tamb=25C. 2. This value includes an external resistor of 24 ohm +/-1%. D-" diagram for testing details. 3. All signals except D+ and D-.
See "Load D+ and
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AC ELECTRICAL CHARACTERISTICS
GND=0V, tR = tF =3.0 ns; CL =50 pF; RL=500 Ohms
Table 5.8 AC Electrical Characteristics
SYMBOL PARAMETER WAVEFORM LIMITS (TAMB) 0C to +25C 0C to +70C MIN TYP MAX MIN MAX 0 0 4 4 9 9 12 12 20 20 0 0 4 4 14 14 20 20 UNIT
tpLH tpHL trise tfall tRFM
VMO/VPO to D+/DFull Speed Rise and Fall Times Full Speed Rise and Fall Time Matching Full Speed VMO/VPO to D+/DLow Speed Rise and Fall Times Low Speed Rise and Fall Time Matching Low Speed D+/D- to RCV
1
ns
2
ns
90
110
90
110
%
tpLH tpHL trise tfall tRFM
1
120 120 75 75
300 300 300 200 75 75
300 300 300 200
ns
2
ns
70
130
70
130
%
tpLH tpHL tpLH tpHL tpHZ tpZH tpLZ tpZL tsu
3
9 9 4 4
16 16 8 8 12 12 10 10
16 16 8 8 12 12 10 10
ns
D+/D- to VP/VM
1
ns
OE# to D+/D- RL = 500ohm Setup for SPEED
4
ns
5
0
ns
Vcr
Crossover point1
3
1.3
2.0
1.3
2.0
V
NOTES: 1. The crossover point is in the range of 1.3V to 2.5V for the low speed mode with a 50 pF capacitance.
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Figure 5.2 Electrical Characteristics Diagram
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5.7 ESD Test Results
Test Description: ESD Testing was performed on a Zapmaster system using the Human-Body-Model (HBM) and Machine-Model (MM), according to MIL-STD 883 and EIAJ IC-121 respectively. Human-Body-Model stresses devices by sudden application of a high voltage supplied by a 100pF capacitor through 1.5k-ohm resistance. Machine-Model stresses devices by sudden application of a high voltage supplied by a 200pF capacitor through very low (0 ohm) resistance.
Test circuit & condition Zap Interval: 1 second Number of Zaps: 3 positive and 3 negative at room temperature Criteria: I-V Curve Tracing Table 5.9 ESD Data
Model HBM MM Mode Vdd, Vss, I/C Vdd, Vss, I/C S/S 15 15 Target 6000V 200V Results PASS PASS
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5.8 Latch-Up Test Results
Test Description: Latch-Up testing was performed at room ambient using an IMCS-4600 system which applies a stepped voltage to one pin per device with all other pins open except Vdd and Vss which were biased to 5Volts and ground respectively. Testing was started at 5.0V (Positive) or 0V (Negative), and the DUT was biased for 0.5 seconds. If neither the PUT current supply nor the device current supply reached the predefined limit (DUT=00mA, Icc=100mA), then the voltage was increased by 0.1Volts and the pin was tested again. This procedure was recommended by the JEDEC JC-40.2 CMOS Logic standardization committee.
Notes: 1. DUT: Device Under Test. 2. PUT: Pin Under Test.
Figure 5.3 Latch-Up Test Results
Test Circuit: Positive Input/Output Overvoltage/Overcurrent
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Test Circuit: Negative Input/Output Overvoltage/Overcurrent
Supply Overvoltage Test
Table 5.10 Latch-Up Data
Mode + Voltage + Current Vdd - Vxx Voltage (V)/Current (mA) 11.0 11.0 200 200 9.0 S/S 5 5 5 5 5 Results Pass Pass Pass Pass Pass
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6.0 Mechanical Information
Following diagrams show the dimensions of the AU9340 28-pin SSOP. Measurements are in inches. Dimensions do not include mold flash and dambar protrusion; allowable mold flash is 0.010 inch.
Figure 6.1 Mechanical Information Diagram
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R REV. ORIG.
DESCRIPTION 1. REGENERATED FROM PO-P402 VERSION"A" 2. ADD GAUGE PLANE ADD CROSS SECTIONA-A" DRAWING MODIFY 0.020 TO 0.002 ADD E-PIN CHANGE PIN "I" DOT DIMENSION
BY JIMMY STEVEN IRIS IRIS
DATE 97.04.21 97.07.31 97.08.21 98.06.10
SYMBOL A A1 A2 b b1 c c1 D E E1 e L L1 R1 R2
COMMON DIMENSION MILLIMETERS MIN. NOM. MAX. 2 0.05 1.65 1.75 1.85 0.22 0.38 0.22 0.3 0.33 0.09 0.25 0.09 0.15 0.21 9.90 10.20 10.50 7.4 7.8 8.2 5 5.3 5.6 0.65 BSC 0.55 0.75 0.95 0.25 REF. 0.09 0.09 0 40 80
COMMON DIMENSION INCH MIN. NOM. MAX. 0.079 0.002 0.065 0.069 0.073 0.009 0.015 0.009 0.012 0.013 0.004 0.01 0.004 0.006 0.008 0.390 0.402 0.413 0.291 0.307 0.323 0.197 0.209 0.22 0.0256 BSC 0.021 0.03 0.037 0.050 REF. 0.004 0.004 0 40 80
N 0 0.30 JEDEC NO.
14 6.20 MO-150 AB
16 6.20 MO-150 AC
18 7.20 MO-150 AD
20 7.20 MO-150 AE
24 8.20 MO-150 AG
28 10.20 MO-150 AH
UNLESS OTHERWISE
DECMAL X xx .10
ANGULAR ORENT SEMCONOUCTOR ELECTRONICS
UNIT
MM
SCALE:10:1
3
SPECIFIED DRAWN CHECKED APPROVED
xxx .05 IRIS 98.06.10 TITLE SSOP 14/16/20/21/28L(209MIL) PACKAGE OUTLINE
SHEET:1 OF1 FILE:PD-P503C DWG. NO.: PD-P503C A3
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MEMO
About Alcor Micro, Corp Alcor Micro, Corp. designs, develops and markets highly integrated and advanced peripheral semiconductor, and software driver solutions for the personal computer and consumer electronics markets worldwide. We specialize in USB solutions and focus on emerging technology such as USB and IEEE 1394. The company offers a range of semiconductors including controllers for USB hub, integrated keyboard/USB hub and USB Flash memory card reader...etc. Alcor Micro, Corp. is based in Taipei, Taiwan, with sales offices in Taipei, Japan, Korea and California. Alcor Micro is distinguished by its ability to provide innovative solutions for spec-driven products. Innovations like single chip solutions for traditional multiple chip products and on-board voltage regulators enable the company to provide cost-efficiency solutions for the computer peripheral device OEM customers worldwide.
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